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    竞博体育app-jbo电竞-Dota2、LoL、CSGO等电竞赛事竞猜

    Description
    SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process. SM-150G and SM-155P are also provided with well plastic shape, a powerful and stable adhesive strength for a variety of component parts.
    Features
    * Physical Characteristics and Application

    NO.

    Items

    Specification

    1

    Chemical Type

    Epoxy

    2

    Components

    One component

    3

    Cure Type

    Heat cure

    4

    Application

    Surface mount adhesive

    5

    Suitable Process

    SM-150G : Glue dot process
    SM-155P : Printing machine process

    6

    Viscosity
    (Brookfield / 5.0rpm / 25℃ )

    SM-150G:55,000 ± 10000 cps
    SM-155P:35,000 ± 7000 cps

    7

    Thixotropy index

    SM-150G:6.5 ± 1.0
    SM-155P:5.0 ± 0.7


    * Typical Curing Performance
    Curing rates depend on the mass of material to be heated and intimate contact with the heat sources. Other curing conditions may also yield satisfied results. Recommended conditions for curing are as follows.
    Recommended Curing Condition
    Curing Temperature
    150℃
    125℃
    100℃
    Curing Time
    1.5~2.0 min
    2.0~3.0 min
    9.0~10 min


    * Performance of Push-off Strength
    Push-off Strength
    Shear Strength (N/mm2)
    Shear forces (Kgf)
    Chip Size
    (Chip:1206R)
    ≧15.0
    ≧7.0
    (Chip:0805R)
    ≧10.0
    ≧2.5
    (Chip:0603R)
    ≧10.0
    ≧1.5

    * Packaging
    SM-150G is syringe based packaging, and the capacities are 10mL, 30mL, and 300ml. SM-155P can be provided with syringe and jar packaging. The capacity is 250mL.

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