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    竞博体育app-jbo电竞-Dota2、LoL、CSGO等电竞赛事竞猜

    竞博体育app-jbo电竞-Dota2、LoL、CSGO等电竞赛事竞猜

    Description
    BGA Solder Sphere is made from pure metals, to produce exact alloy compositions. We developed and produced under a strict research and quality control policy.

    Our Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip applications are made by the UMT ( Ultra Micron Technology) to ensure spheres with accurate diameters, bright, shiny surface finishes; and high sphericity. We have own developed technology which reduces raw material cost, accordingly competitive price make users benefited. With our newest in-house production machine, we can comply with customer’s request of various sizes. 竞博体育app-jbo电竞-Dota2、LoL、CSGO等电竞赛事竞猜 is available for customers' specifications.


    Bumpping錫膏

    Features
    Diameter
    Tolerance
    0.76mm~0.50mm
    ±20um
    0.45mm~0.10mm
    ±10um
    * Please contact us for other diameter and any requirement.
    History
    3Inquiry
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