SAN JOSE, CA ― October 2018 ― SHENMAO Technology, Inc. today announced plans to exhibit in Booth A21 at NEPCON Vietnam, scheduled to take place Oct. 11-13, 2018 at the Saigon Exhibition and Convention Center in Ho Chi Minh, Vietnam. SHENMAO plans to introduce its new solder paste PF606-P245, and PF606-F13 and PF604-JF3 solder wires.
PF606-P245 solder paste has solved head on pillow issues and improved ICT testability. With the wide reflow window, PF606-P245 can easily fit into the process of most complicated PCB design.
PF606-F13 is a lead-free and halogen-free solder wire designed for automatic soldering machines. It offers excellent solder joint reliability and joint strength.
PF604-JF3 is suitable for high temperature flame type soldering, which is used in the bending process of copper tubes for air conditioners.
NEPCON Vietnam 2018 is the 11th edition of Vietnam’s only exhibition on SMT, testing technologies, equipment and supporting industries for electronics manufacturing. It is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain.
Visit SHENMAO in Booth A21 to speak with the company’s technical experts. For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.