Topic: Study on A Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Microbump Interconnect
Speaker: Ya-Ching Chuang
Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Time: 4/27, Session 16 Packaging Technology, 14:00-14:30.
Location: Room 305, KINTEX, S. KOREA.
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